---

高導(dǎo)熱材料與陶瓷基板

---

張振昊, 孫海濱, 楊榮坤, 等. 六方氮化硼在絕緣導(dǎo)熱聚合物復(fù)合材料中應(yīng)用研究進(jìn)展. 現(xiàn)代技術(shù)陶瓷，2020, 41: 256-268.
Zhang ZH, Sun HB, Yang RK, et al. Research progress of hexagonal boron nitride in insulating thermal conductive polymer composites. Advcanced Ceramics, 2020, 41: 256-268.

程浩, 陳明祥, 羅小兵, 等. 電子封裝陶瓷基板. 現(xiàn)代技術(shù)陶瓷，2019, 40: 265-292.
Cheng H, Chen MX, Luo XB, et al. Ceramic substrate for electronic packaging. Advcanced Ceramics, 2019, 40: 265-292.

梁琦, 肖東, 林慧興, 等. 電子基板用玻璃/陶瓷復(fù)合材料的低溫共燒與性能. 現(xiàn)代技術(shù)陶瓷，2017, 38: 96-107.
Liang Q, Xiao D, Lin HX, et al. Low-temperature co-fired and properties of ceramics/glass composites for electronic substrates. Advcanced Ceramics, 2017, 38: 96-107.

丁利文, 范桂芬, 李鏡人, 等. AlN陶瓷的性能及應(yīng)用. 現(xiàn)代技術(shù)陶瓷，2016, 37: 22-33.
Ding LW, Fan GF, Li JR, et al. Performance and Application of AlN Ceramics. Advcanced Ceramics, 2016, 37: 22-33.

---